Monday, July 24, 2006
SEMIKRON and Chorus Motors Work Together to Develop Unique Motor Systems Solutions
The first demonstration system to result from the agreement between SEMIKRON and Chorus Motors plc (OTC: CHOMF) to develop the Chorus Meshcon motor and drive technology has been used to move a widebody Air Canada aircraft on the ground without using a tug or its own jet engines.
Following an approach from Chorus, the two companies agreed earlier this year for SEMIKRON to apply its design and applications expertise to the Chorus Meshcon drive concept, in exchange for exclusive supplier status for certain markets. SEMIKRON is designing Chorus Meshcon integrated power assemblies for test motor and drive systems and is expecting to design and manufacture these assemblies for the high end specialty markets.
The Chorus Meshcon drive operates with a very high number of phases -- up to 20 or more -- optimised for the specific application. This offers a system that, because of its small size, high power density, and torque-speed performance, achieves what no other motor-drive solution can. Applications are expected to be in areas as diverse as starter-alternators for cars, conveyors, locomotives, hoists, robotics and marine applications. Other aerospace applications, such as starter generators for jet turbines, are likely to be developed in the near-term. Another potential application is as a replacement for some hydraulic systems, where it is desirable for the motor to start and stop frequently, often under load.
SEMIKRON's solution is based on its MiniSKiiP® (SEMIKRON integrated intelligent power) subsystem. The compact design of MiniSKiiP integrates power semiconductor switches, a heat sink, a gate driver unit with protection, and current and heatsink temperature sensors. Its patented pressure contact technology allows a compact power module design with very low thermal resistances, high thermal cycling capability and low parasitic stray inductances, which is well suited to high-vibration environments. The SKiiP technology presses the direct bonded copper substrate onto the heatsink with a uniform pressure spreader, thus ensuring a consistent low thermal resistance without the need for a copper baseplate.
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